Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate

A method comprising:

• providing a soft laminate having a thickness which is substantially a quarter of a predetermined wavelength to be transmitted through a waveguide;
• printing a feed on a low loss substrate, the feed being an extension of a planar transmission line;
• wherein the planar transmission line including the feed extends along a single planar conducting layer;
• cutting a second cavity into the soft laminate;
• laminating the low loss substrate onto the soft laminate after cutting said second cavity, such that the second cavity is under the feed and the low loss substrate, and the low loss substrate being essentially self-supported over the second cavity;
• placing a back-short above the low loss substrate and the second cavity, wherein the back-short comprises a first cavity of depth equivalent to about a quarter wave-length;
• and
• coupling the waveguide to the second cavity such that the second cavity forms a continuation with the waveguide.

A method comprising:

• printing a feed on a second side of a low loss substrate, the feed being an extension of a planar transmission line;
• wherein the planar transmission line including the feed extends along single planar conducting layer;
• cutting a second cavity into a soft laminate;
• providing a metal plating around said second cavity;
• laminating a first side of the low loss substrate onto the soft laminate after said metal plating has been provided;
• placing a back-short comprising a first cavity of depth equivalent to about a quarter wave-length on the second side of the low loss substrate, the back-short being electrically connected to the metal plating, and the first cavity is essentially above the second cavity;
• and
• placing a waveguide in contact with the second cavity such that the second cavity forms a continuation with the waveguide.

A low-loss interface comprising:

• a low loss substrate comprising, on a first side, a contact location for an integrated circuit, and on a second side, a waveguide location;
• a planar transmission line extending along said first side from said contact location to above said waveguide location as a monopole waveguide feed;
• wherein the planar transmission line including said monopole waveguide feed extends along a single planar conducting layer;
• a back-short electrically coupled to the first side and located essentially above the waveguide location;
• the back-short comprises a first cavity of depth equivalent to about a quarter wave-length;
• a soft laminate comprising a second cavity coupled to the waveguide location;
• and
• a waveguide coupled to and continuous with the second cavity.

A method comprising:

• printing a feed on a low loss substrate, the feed being an extension of a planar transmission line, and the low loss substrate being non-ceramic;
• wherein the planar transmission line including the feed extends along a single planar conducting layer;
• cutting a second cavity into a soft laminate;
• metal plating around said second cavity;
• laminating the low loss substrate onto the soft laminate after said metal plating, such that the second cavity is under the feed and the low loss substrate;
• placing a back-short above the low loss substrate and the second cavity, wherein the back-short comprises a first cavity of depth equivalent to about a quarter wave-length;
• and
• coupling a waveguide to the second cavity such that the second cavity forms a continuation with the waveguide.