Test contact system for testing integrated circuits with packages having an array of signal and power contacts

A test fixture for forming a plurality of temporary mechanical and electrical connections between a device under test having a plurality of terminals and a load board having a plurality of connection pads, the terminals and connection pads being in a one-to-one correspondence, comprising:

• a replaceable interface membrane disposed generally parallel to and adjacent to the load board,
• the interface membrane including a plurality of vias in a one-to-one correspondence with the plurality of connection pads of the load board, each via having with a base adjacent to a corresponding connection pad on the load board and a rim extending away from the load board;
• and
• a replaceable contact membrane disposed generally parallel to and adjacent to the interface membrane, the interface membrane being between the load board and the contact membrane,
• the contact membrane including a plurality of connection pads facing the interface membrane, each via on the interface membrane corresponding to at least one connection pad on the contact membrane,
• the contact membrane including a plurality of contact pads facing away from the interface membrane, each contact pad in the plurality being permanently electrically connected to at least one of the plurality of connection pads, each via on the interface membrane corresponding to at least one contact pad on the contact membrane;
• wherein each contact pad corresponding to a particular via is configured to mechanically and electrically receive the terminal on the device under test corresponding to the particular via;
• and
• wherein when the device under test is attached to the test fixture,
• the interface membrane contacts the load board,
• the contact membrane contacts the interface membrane, and
• the plurality of terminals on the device under test are electrically connected in a one-to-one correspondence to the plurality of connection pads on the load board.