Sealing resin sheet, method for producing electronic component package and electronic component package
AssigneeNitto Denko Corporation
InventorsEiji Toyoda, Yusaku Shimizu
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Abstract
Provided are a sealing resin sheet, wherein a clean, smooth and flat ground surface is obtained by grinding after resin sealing, a method for producing an electronic component package using the same, and an electronic component package obtained by the production method. The present invention provides a sealing resin sheet, wherein a ground surface has a mean surface roughness Ra of 1 μm or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 μm and a cut depth of 10 μm after a heat curing treatment is performed at 180° C. for 1 hour; and a Shore D hardness at 100° C. after the heat curing treatment is 70 or more.
Claims10
A sealing resin sheet, wherein
- a ground surface has a mean surface roughness Ra of 1 μm or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 μm and a cut depth of 10 μm after a heat curing treatment is performed at 180° C. for 1 hour;
- and
- a Shore D hardness at 100° C. after the heat curing treatment is 70 or more.
Dependencies are inferred from the claim text.