Packaged integrated circuit using wire bonds
AssigneeFreescale Semiconductor, Inc.
InventorsRobert J. Wenzel, Kevin J. Hess, Chu-Chung Lee
Life of this patent
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Abstract
A semiconductor device includes an integrated circuit die on a substrate. A first subset of wire bonds is between the substrate and the die. A second subset of wire bonds is between the substrate and the die. A dielectric material coats the first subset of the wire bonds along a majority of length of the first subset of the wire bonds. A medium is in contact with the second subset of the wire bonds along a majority of length of the second subset of the wire bonds.
Claims18
A semiconductor device comprising:
- a substrate;
- an integrated circuit die on the substrate;
- a first subset of wire bonds between the substrate and the integrated circuit die;
- a second subset of wire bonds between the substrate and the integrated circuit die;
- a dielectric material coating the first subset of the wire bonds along a majority of length of the first subset of the wire bonds, wherein the dielectric material includes a poregen material;
- and
- a medium in contact with the second subset of the wire bonds along a majority of length of the second subset of the wire bonds.
A semiconductor device comprising:
- a first surface;
- a second surface;
- a plurality of wire bonds between the first surface and the second surface;
- and
- a dielectric material coating a first subset of the wire bonds, wherein properties of the dielectric material are different from a medium in contact with a second subset of the wire bonds so that the first subset of the wire bonds is electrically decoupled from a second subset of the plurality of wire bonds, wherein the dielectric material coats the first subset of the wire bonds for a majority of a length of the first subset of wire bonds, and wherein the dielectric material includes a poregen material.
A method for fabricating a semiconductor device, the semiconductor device includes a plurality of wire bonds between a first set of contact pads and a second set of contact pads, the method comprising:
- dispensing a first dielectric coating on a first subset of the plurality of wire bonds, wherein the coating covers a majority of length of the first subset of the plurality of wire bonds and capacitance of a combination of the first dielectric coating and the first subset of the plurality of wire bonds is different from capacitance of the first subset of the plurality of wire bonds, and wherein the dielectric material includes a poregen material.
Dependencies are inferred from the claim text.