Back to results
US 8,912,665 B2Granted
Dicing tape-integrated film for semiconductor back surface
AssigneeNitto Denko Corporation
InventorsMiki Hayashi, Naohide Takamoto
Life of this patent
Estimating the term…
Abstract
The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.
Claims4
A dicing tape-integrated film for semiconductor back surface which is a non-circuit surface, comprising:
- a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material;
- and
- a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer,
- wherein the film for flip chip type semiconductor back surface which is the non-circuit surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa,
- wherein the film for flip chip type semiconductor back surface contains a coloring agent added thereto, and
- wherein the film the for flip chip type semiconductor back surface has a moisture absorbance of not more than 1% by weight after the film for flip chip type semiconductor back surface is allowed to stand under an atmosphere at 85° C. and 85% RH for 168 hours.
3 more elements
Dependencies are inferred from the claim text.