US 8,912,664 B1Granted

Leadless multi-chip module structure

AssigneeMarvell International Ltd.

InventorsShiann-Ming Liou, Huahung Kao

Life of this patent

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Abstract

Multi-chip quad flat no-lead (QFN) packages and methods for making the same are disclosed. A multi-chip package may include a first die including a plurality of first bond pads, wherein selected first bond pads are wire-bonded to a first side of a leadframe, and a second die mounted on the first die and including a plurality of second bond pads, wherein selected second bond pads are wire-bonded to a second side, opposite the first side, of the leadframe. Another package may include a first die including a plurality of first bond pads, wherein selected first bond pads are wire-bonded to a first side of a leadframe, and a second die flip-chip mounted on a second side of the leadframe and including a plurality of second bond pads, wherein selected second bond pads are bonded to the second side of the leadframe. Other embodiments are also described.

Claims15

Dependent claims

A semiconductor device comprising:

a leadframe;
a first die including a first bond pad, wherein the first bond pad of the first die is wire-bonded to a first side of the leadframe via a first bond wire, wherein the first die has (i) a first side and (ii) a second side that is opposite the first side of the first die, wherein the first bond pad is disposed on the first side of the first die;
a second die, wherein (i) a first section of the second die is mounted on a second side of the leadframe and (ii) a second section of the second die is over the first die, wherein the second side of the leadframe is opposite to the first side of the leadframe;
a mold compound encapsulating (i) the first bond wire, and (ii) the first side of the first die;
and
an underfill material formed (i) between the second section of the second die and the second side of the first die, and (ii) between the first section of the second die and the second side of the leadframe, wherein the underfill material is different from the mold compound.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/195,625Filed 3 Mar 2014 · continuation
Priority: 29 Aug 2007
Granted: 16 Dec 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

H10W 70/415
Chip-supporting parts, e.g. die pads: leadframe inner leads serving as die pads
H10W 70/427
Cross-sectional shapes: bent parts
H10W 74/111
Characterised by their shape or disposition: the semiconductor body being completely enclosed
H10W 90/00
Package configurations

Family

Application60/968,752Us provisional application · filed 29 Aug 2007
Application12/196,948Parent of this division · filed 22 Aug 2008
Application13/745,554Parent of this continuation · filed 18 Jan 2013
US 8,358,013 B1Parent of this division · filed 22 Jan 2013
US 8,669,139 B1Parent of this continuation
Application13/745,554Parent of this division
US 8,912,664 B1This patent

From the US filing history. Foreign family members aren’t listed.