Plasma treatment on semiconductor wafers

A device, comprising:

• a die having a plurality of contact pads exposed through a first surface of the die;
• a passivation structure on the first surface of the die, the passivation structure including:
• a first dielectric layer on the first surface;
• and
• a second dielectric layer on the first dielectric layer, the passivation structure includes high points and low points, the high points including the second dielectric layer and the low points extending into the first dielectric layer;
• an encapsulation layer formed on a second surface of the die and on sides of the die;
• a redistribution layer including a third dielectric layer in contact with the high points and low points of the passivation structure and the third dielectric layer in direct contact with the encapsulation layer;
• and
• external contacts formed on the redistribution layer, the external contacts being physically separated from the contact pads by the redistribution layer and electrically coupled to the contact pads through the redistribution layer.

A method, comprising:

• forming a plurality of die on a semiconductor wafer, each die including integrated circuit having a plurality of contact pads exposed at an upper surface of the wafer;
• forming a passivation structure overlying the upper surface of the wafer;
• exposing the contact pads by etching a selected pattern into the passivation structure;
• forming a rough surface on the passivation structure and the contact pads across the wafer by exposing the passivation structure and the contact pads to an ionized gas;
• separating the wafer into the die after forming the rough surface, each die having the rough surface;
• affixing the rough surface of each die to an adhesion layer;
• forming an encapsulant on the die and on the adhesion layer;
• removing the adhesion layer after forming the encapsulant;
• forming a redistribution layer coupled to the contact pads of each die;
• and
• separating the die into a plurality of semiconductor packages, each package including the die with the rough surface.