Semiconductor device and method for manufacturing same

A semiconductor device comprising:

• a vertical semiconductor element having bonding surfaces, in pairs, the bonding surfaces being provided between bus bars, in pairs, the bus bars being opposed to each other;
• a sintered-metal bonding layer made of a sintered-metal, provided on each of the bonding surfaces, in pairs;
• a through-hole opened in at least one of the bus bars, in pairs;
• and
• a heat-release member having electrical conductivity, and a high thermal conductivity as compared with solder, a surface of the heat-release member, on one side thereof, being bonded to the sintered-metal bonding layer on at least one of the bonding surfaces, in pairs, while a side (a lateral face) of a surface of the heat-release member, on the other side thereof, being fitted into the through-hole,
• wherein a solder layer is formed in a gap between an outer-side wall of the side of the surface of the heat-release member, on the other side thereof, and an inner-side wall of the through-hole opened in at least the one of the bus bars, in pairs.