Low profile electronic package and associated methods
AssigneeHarris Corporation
InventorsLouis Joseph Rendek, Jr., Michael Raymond Weatherspoon
Life of this patent
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Abstract
An electronic package includes a printed wiring board (PWB) having a die-receiving cavity therein, a semiconductor die in the die-receiving cavity and coupled to the PWB, and a lid mating ring at an upper surface of the PWB surrounding the die-receiving cavity. The lid mating ring has spaced apart pillar-receiving openings therein. A lid is coupled to the lid mating ring and covers the semiconductor die within the die-receiving cavity. The lid includes a liquid crystal polymer (LCP) layer, and spaced apart pillars extending downwardly from a lower surface of the LCP layer and received in corresponding ones of the spaced apart pillar-receiving openings.
Claims26
An electronic package comprising:
- a printed wiring board (PWB) having a die-receiving cavity therein;
- a semiconductor die in the die-receiving cavity and coupled to said PWB;
- a lid mating ring at an upper surface of said PWB surrounding the die-receiving cavity, said lid mating ring having a plurality of spaced apart pillar-receiving openings therein;
- and
- a lid coupled to said lid mating ring and covering said semiconductor die within the die-receiving cavity, said lid comprising
- a liquid crystal polymer (LCP) layer, and
- a plurality of spaced apart pillars extending downwardly from a lower surface of said LCP layer and received in corresponding ones of said plurality of spaced apart pillar-receiving openings.
An electronic package comprising:
- a printed wiring board having a die-receiving cavity therein;
- a semiconductor die in the die-receiving cavity and coupled to said PWB;
- a lid mating ring at an upper surface of said PWB surrounding the die-receiving cavity, said lid mating ring having a plurality of spaced apart pillar-receiving openings therein;
- and
- a removable lid coupled to said lid mating ring and covering said semiconductor die within the die-receiving cavity, said removable lid comprising
- a liquid crystal polymer (LCP) layer having a planar shape, and
- a plurality of spaced apart pillars extending downwardly from a lower surface of said LCP layer and received in corresponding ones of said plurality of spaced apart pillar-receiving openings, and
- a PWB mating ring carried by said LCP layer and aligned with said lid mating ring.
A method for making an electronic package comprising:
- providing a printed wiring board (PWB) having a die-receiving cavity therein;
- forming a lid-mating ring at an upper surface of the PWB surrounding the die-receiving cavity, with the lid-mating ring having a plurality of spaced apart pillar-receiving openings therein;
- positioning a semiconductor die in the die-receiving cavity and coupling the semiconductor die to the PWB;
- and
- coupling a lid to the lid-mating ring, with the lid comprising a liquid crystal polymer (LCP) layer, and a plurality of spaced apart pillars extending downwardly from a lower surface of the LCP layer and received in corresponding ones of the plurality of spaced apart pillar-receiving openings.
Dependencies are inferred from the claim text.