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US 8,912,637 B1Granted
Self-adhesive die
AssigneeTexas Instruments Incorporated
InventorRongwei Zhang
Life of this patent
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Abstract
A method and apparatus for enhancing the thermal performance of semiconductor packages effectively. The concept of this invention is to provide silicon nanowires on the backside of an integrated circuit die to directly attach the die to the substrate, thereby improving the interface between die and substrate, and thus enhancing thermal performance and enhancing reliability by improving adhesion.
Claims6
A method of attaching a semiconductor die to a substrate, comprising the steps;
- providing a semiconductor wafer containing integrated circuits, wherein the wafer has a top side and a backside;
- printing an ink containing metal nanoparticles of the backside of the wafer;
- etching a plurality of cavities on the backside of the wafers using metal assisted etching to form a plurality of silicon nanowires;
- separating the semiconductor wafer into individual integrated circuit die;
- providing a substrate, having a top side with a die attach pad, and a backside;
- positioning the backside of integrated circuit die on the die attach pad while maintaining the top surface of the die in a parallel with the top surface of the substrate;
- and
- attaching the integrated circuit die to the substrate by the silicon nanowires using pressure between 0.01 and 1 Megapascal (MPa).
5 more elements
Dependencies are inferred from the claim text.