Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorTsuneo Ogura
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AssigneeKabushiki Kaisha Toshiba
InventorTsuneo Ogura
Estimating the term…
According to one embodiment, a semiconductor device includes a first major electrode, a first semiconductor layer, a first conductivity type base layer, a second conductivity type base layer, a first conductivity type second semiconductor layer, a gate insulating film, a gate electrode, and a second major electrode. The gate insulating film is provided on a side wall of a trench penetrating the second conductivity type base layer to reach the first conductivity type base layer. The gate electrode is provided inside the gate insulating film in the trench. The second major electrode is provided on the second semiconductor layer and electrically connected with the second semiconductor layer. A maximum impurity concentration in the second semiconductor layer is within ten times a maximum impurity concentration in the second conductivity type base layer.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.