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US 8,912,630 B2Granted
Integrated circuit including thermal gate, related method and design structure
AssigneeInternational Business Machines Corporation
InventorsJed H. Rankin, Robert R. Robison, Dustin K. Slisher
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) and a method of making the same. In one embodiment, the IC includes: a substrate; an insulation layer over the substrate; a resistor over the insulation layer; a thermal gate over the resistor; and a heat sink connected to the thermal gate via a substrate contact, the heat sink adapted to receive thermal energy from the resistor via the thermal gate.
Claims20
An integrated circuit, comprising:
- a substrate;
- an insulation layer over the substrate;
- a resistor over the insulation layer;
- a first thermal gate over the resistor without contact thereof;
- a second thermal gate over the resistor without contact thereof;
- a heat sink contact having a top surface that is level with a top surface of the first thermal gate and a bottom surface that is over the resistor;
- a first metal layer interconnect having a bottom surface with a first portion that contacts the top surface of the first thermal gate and a second portion that contacts the top surface of the heat sink contact;
- a heat sink connected to the first thermal gate via the heat sink contact and the first metal layer interconnect, the heat sink formed in a portion of the resistor, wherein the heat sink is adapted to receive thermal energy that dissipates from the resistor through a flow path that includes the first thermal gate, the first metal layer interconnect, and the heat sink contact, the flow path terminating in the heat sink;
- and
- a substrate contact having a top surface that is level with a top surface of the second thermal gate, a bottom surface in contact with the substrate, and sidewalls having a portion in contact with the resistor, wherein the substrate contact is adapted to dissipate the thermal energy from the resistor to the substrate via the second thermal gate.
7 more elements
A design structure tangibly embodied in a machine readable medium for design, manufacturing, or testing an integrated circuit, the design structure comprising:
- a substrate;
- an insulation layer over the substrate;
- a resistor over the insulation layer;
- a first thermal gate over the resistor without contact thereof;
- a second thermal gate over the resistor without contact thereof;
- a heat sink contact having a top surface that is level with a top surface of the first thermal gate and a bottom surface that is over the resistor;
- a first metal layer interconnect having a bottom surface with a first portion that contacts the top surface of the first thermal gate and a second portion that contacts the top surface of the heat sink contact;
- a heat sink connected to the first thermal gate via the heat sink contact and the first metal layer interconnect, the heat sink formed in a portion of the resistor, wherein the heat sink is adapted to receive thermal energy that dissipates from the resistor through a flow path that includes the first thermal gate, the first metal layer interconnect, and the heat sink contact, the flow path terminating in the heat sink;
- and
- a substrate contact having a top surface that is level with a top surface of the second thermal gate, a bottom surface in contact with the substrate, and sidewalls having a portion in contact with the resistor, wherein the substrate contact is adapted to dissipate the thermal energy from the resistor to the substrate via the second thermal gate.
7 more elements
Dependencies are inferred from the claim text.