Light emitting diode package
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsPi-Chiang Hu, Shih-Yuan Hsu
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Abstract
An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes an encapsulation layer sealing the LED chip therein. The light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer seals the light transmission layer therein.
Claims10
An LED (light emitting diode) package, comprising:
- a substrate comprising a first electrode, and a second electrode separated and electrically insulated from the first electrode;
- an LED chip arranged on the substrate, the LED chip being electrically connected to the first electrode and the second electrode of the substrate;
- an encapsulation layer is formed on the substrate to seal the LED chips therein;
- and
- a light transmission layer arranged on a light output path of the LED chip, the light transmission layer comprising two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates;
- wherein the light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer also seals the light transmission layer therein.
Dependencies are inferred from the claim text.