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US 8,912,555 B2Granted
Semiconductor light-emitting device
AssigneePhostek, Inc.
InventorsShih-Feng Shao, Heng Liu, Jinn Kong Sheu
Life of this patent
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Abstract
A semiconductor light-emitting device includes a circuit board with a layout layer and a die bonding area. At least one positive endpoint, negative endpoint and function endpoint are disposed on the layout layer. At least one semiconductor light-emitting chip is disposed within the die bonding area, and is electrically coupled to the positive endpoint, the negative endpoint and the function endpoint to facilitate various connection configurations.
Claims14
A semiconductor light-emitting device, comprising:
- a circuit board having a layout layer and a die bonding area;
- at least one positive endpoint disposed on the layout layer;
- at least one negative endpoint disposed on the layout layer;
- at least one function endpoint disposed on the layout layer;
- and
- at least one semiconductor light-emitting chip, disposed within the die bonding area and electrically coupled to the positive endpoint, the negative endpoint or the function endpoint to result in various electrical connection configurations.
3 more elements
A package for a semiconductor light-emitting chip, the package comprising:
- a layout layer;
- a cover layer disposed over the layout later;
- a die bonding area disposed through openings in the cover layer and the layout layer;
- and
- a plurality of openings in the cover layer disposed around the die bonding area, the plurality of openings including:
- at least one positive endpoint opening;
- at least one negative endpoint opening;
- at least one elongated openings;
- and
- at least one short openings;
- wherein the plurality of openings facilitate a variety of series and parallel connection combinations for at least one semiconductor light-emitting chip.
8 more elements
Dependencies are inferred from the claim text.