Electronic component package

An electronic component package having a cavity for accommodating an electronic component, the electronic component package comprising:

• a circuit board which has a mounting surface, on which the electronic component is mounted;
• a bonding pattern that has a discontinuous part where the mounting surface is exposed, and is formed on the circuit board so that parts other than the discontinuous part continuously surround the mounting surface;
• a lid that has a shape such that the cavity is formed between the lid and the circuit board, the lid having a bonding surface formed in a same ring shape as the bonding pattern;
• a solder pre-coat that bonds the bonding surface of the lid to the top bonding pattern, wherein,
• the bonding pattern shows wettability for fluxless solder, the bonding surface of the lid does not show wettability for fluxless solder,
• ring-shaped flux solder is formed on the bonding surface of the lid and has at least one discontinuous part,
• the solder pre-coat is formed to be a fluxless solder layer by heating the ring-shaped flux solder and removing flux therefrom, and
• the bonding surface of the lid is bonded to the bonding pattern via the solder pre-coat and a ventilation hole is formed at the at least one discontinuous part.

An electronic component package having a cavity for accommodating an electronic component, the electronic component package comprising:

• a circuit board which has a mounting surface, on which the electronic component is mounted;
• a bonding pattern that has a discontinuous part where the mounting surface is exposed, and is formed on the circuit board so that parts other than the discontinuous part continuously surround the mounting surface;
• a lid that has a shape such that the cavity is formed between the lid and the circuit board, the lid having a bonding surface formed in a same ring shape as the bonding pattern;
• a solder pre-coat that bonds the bonding surface of the lid to the bonding pattern, wherein
• the bonding pattern shows wettability for fluxless solder, the bonding surface of the lid does not show wettability for fluxless solder,
• ring-shaped flux solder is formed on the bonding surface of the lid and has at least one discontinuous part,
• the solder pre-coat is formed to be a fluxless solder layer by heating the ring-shaped flux solder and removing flux therefrom, and
• the bonding surface of the lid is bonded to the bonding pattern via the solder pre-coat and a ventilation hole is formed at the at least one discontinuous part.