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US 8,912,450 B2Granted
Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
AssigneeInfineon Technologies AG
InventorsJoachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz
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Abstract
A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
Claims6
A chip-packaging module comprising:
- a chip and a chip carrier;
- a metal surface formed over a surface of the chip;
- a first polymer layer, having a thickness of 20 μm or less, formed over the metal surface;
- a second polymer layer formed over a surface of the chip carrier;
- and
- at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure formed of the first polymer layer and the second polymer layer.
3 more elements
Dependencies are inferred from the claim text.