US 8,912,449 B2 · Thermal warp compensation IC package

Abstract

An apparatus and method for temperature induced warpage compensation in an integrated circuit package is disclosed. The apparatus consists of bonded layers of material having different thermal coefficients of expansion. The bonded layers are bonded to the top of the integrated circuit package. By appropriate choice of temperature coefficients the layers of material can compensate for either convex or concave warpage. In some embodiments, the layers of material have apertures therein allowing compensation for more complex warpages. As well, in some embodiments the top layer of material does not have a planar cross-section. A method is also disclosed for manufacturing an integrated circuit package assembly. The apparatus and method provide an alternative to methods of dealing with IC package warpage known in the art.

Claims10

Dependent claims

A temperature responsive warpage counteracting integrated circuit assembly for use with an integrated circuit package having a connection grid side and a top side, said temperature responsive warpage counteracting integrated circuit assembly comprising:

a first layer of a first material having a first coefficient of temperature expansion and a first and second surface;
a second layer of a second material having a second coefficient of temperature expansion different from said first coefficient of temperature expansion and a first and second surface;
said first surface of said second layer bonded to the second surface of said first layer;
and
said second surface of second layer bonded to the top side of said integrated circuit package, wherein the first layer has either a planar-convex cross section or a planar-concave cross section with a planar portion at the second surface.

2 more elements

Dependencies are inferred from the claim text.

Thermal warp compensation IC package

Life of this patent

Thermal warp compensation IC package

Life of this patent

Abstract

Claims10