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US 8,912,295 B2Granted
Long chain alkylene group-containing epoxy compound
AssigneeNissan Chemical Industries, Ltd.
InventorsToshiaki Takeyama, Takeo Moro
Life of this patent
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Abstract
It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).
Claims11
A thermosetting composition comprising:
- (i) an epoxy compound (A) of Formula (1):
- where R1, R2, and R3 are independently a branched or linear C1-6 alkylene group or oxyalkylene group, E1, E2, and E3 are independently an epoxy-containing group of Formula (2):
- an organic group of Formula (3):
- (where R4 is a hydrogen atom or a methyl group), or a hydrogen atom, and a proportion of the epoxy-containing group of Formula (2) is 85 to 98 mol % to the total number of moles of E1, E2, and E3, and
- (ii) a curing agent
- wherein the curing went is contained in a proportion of 0.5 to 1.5 equivalents to the epoxy group in the epoxy compound (A).
3 more elements
Dependencies are inferred from the claim text.