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US 8,912,279 B2Granted
Resin composition
AssigneeAjinomoto Co., Inc.
InventorsShigeo Nakamura, Kazuhiko Tsurui, Masanori Yoda
Life of this patent
Estimating the term…
Abstract
Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.
Claims23
A resin composition, comprising:
- (A) at least one epoxy resin;
- (B) at least one alkoxy oligomer;
- and
- (C) at least one inorganic filler,
- wherein:
- said at least one alkoxy oligomer (B) is one or more selected from the group consisting of a glycidoxyalkyl group-containing alkoxysilyl resin, an aminoalkyl group-containing alkoxysilyl resin, and a mercaptoalkyl group-containing alkoxysilyl resin;
- an average particle diameter of said at least one inorganic filler (C) is 0.01 μm or more and 3 μm or less,
- a content of said at least one alkoxy oligomer (B) is 0.1 to 5% by mass when a content of said at least one inorganic filler (C) is defined as 100% by mass, and
- the resin composition is suitable for an insulating layer of a multilayered printed wiring board on which a conductive layer is formed by plating.
6 more elements
A method of manufacturing a multilayered printed wiring board, the method comprising:
- curing a resin composition to form an insulating layer, wherein the resin composition comprises (A) at least one epoxy resin, (B) at least one alkoxy oligomer, and (C) at least one inorganic filler, said at least one alkoxy oligomer (B) is one or more selected from the group consisting of a glycidoxyalkyl group-containing alkoxysilyl resin, an aminoalkyl group-containing alkoxysilyl resin, and a mercaptoalkyl group-containing alkoxysilyl resin, an average particle diameter of said at least one inorganic filler (C) is 0.01 μm or more and 3 μm or less, and a content of said at least one alkoxy oligomer (B) is 0.1 to 5% by mass when a content of said at least one inorganic filler (C) is defined as 100% by mass;
- and
- plating a surface of said insulating layer to form a conductive layer.
Dependencies are inferred from the claim text.