US 8,912,278 B2Granted

Thermally conductive resin composition and thermally conductive sheet including the same

AssigneeNippon Valqua Industries, Ltd.

InventorHirohisa Imada

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Abstract

A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20, (A1)/(B1)=20/80 to 80/20, and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided.

Claims5

Dependent claims

A thermally conductive resin composition, comprising:

(A1) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two hydrosilyl group(s) at molecule terminal of main chain, in which a content of molecules having two hydrosilyl groups is 60 to 100 mole %;
(B1) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two alkenyl group(s) at molecule terminal of main chain, in which a content of molecules having two alkenyl groups is 60 to 100 mole %;
(A2) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two hydrosilyl group(s) at molecule terminal of main chain, in which a content of molecules having two hydrosilyl groups is 0 to 40 mole %;
(B2) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two alkenyl group(s) at molecule terminal of main chain, in which a content of molecules having two alkenyl groups is 0 to 40 mole %;
and
(C) a thermally conductive filler,
said thermally conductive resin composition satisfying, in connection with the content of said fluorine-based compounds (A1), (B1), (A2), and (B2), following Equations [1] to [3]
[(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20 by weight [1]
(A1)/(B1)=20/80 to 80/20 by weight [2]
(A2)/(B2)=20/80 to 80/20 by weight [3]
said fluorine-based compounds (A1), (B1), (A2), and (B2) have a main chain structure expressed with following Formula [6]
(where n is an integer from 1 to 10).

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/826,255Filed 14 Mar 2013
Priority: JP 2012-06176719 Mar 2012
Published: US 2013/0240778 A119 Sep 2013
Granted: 16 Dec 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

C09K 5/14
Materials not undergoing a change of physical state when used: solid materials, e.g. powdery or granular
C09K 5/00
Heat-transfer, heat-exchange or heat-storage materials
H05K 7/20436
Characterised by the heat transfer by conduction from the heat generating element to a dissipating body: inner thermal coupling elements in heat…
C09K
Materials for miscellaneous applications, not provided for elsewhere