Wafer edge warp supression for thin wafer supported by tape frame
AssigneeApplied Materials, Inc.
InventorsWei-Sheng Lei, Brad Eaton, Ajay Kumar
Life of this patent
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Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of reducing edge warping in a supported semiconductor wafer involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier comprising a tape frame mounted above the carrier tape. The method also involves adhering an adhesive tape to a front side of the semiconductor wafer and to at least a portion of the substrate carrier. The adhesive tape includes an opening exposing an inner region of the front side of the semiconductor wafer.
Claims20
A method of reducing edge warping in a supported semiconductor wafer, the method comprising:
- adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier comprising a tape frame mounted above the carrier tape;
- and
- adhering an adhesive tape to a front side of the semiconductor wafer and to at least a portion of the substrate carrier, the adhesive tape comprising an opening exposing an inner region of the front side of the semiconductor wafer.
An apparatus including a supported semiconductor wafer, the apparatus comprising:
- a substrate carrier comprising a tape frame mounted above a carrier tape;
- a semiconductor wafer having a backside mounted to an inner portion of the carrier tape;
- and
- an adhesive tape adhered to a front side of the semiconductor wafer and to at least a portion of the substrate carrier, the adhesive tape comprising an opening exposing an inner region of the front side of the semiconductor wafer.
A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
- introducing a substrate supported by a substrate carrier into a plasma etch chamber, the substrate having a patterned mask thereon covering integrated circuits and exposing streets of the substrate, wherein the substrate carrier comprises a tape frame mounted above a carrier tape and a backside of the substrate is mounted to an inner portion of the carrier tape, and wherein an adhesive tape is adhered to a front side of the substrate and to at least a portion of the substrate carrier and comprises an opening exposing an inner region of the front side of the semiconductor wafer;
- and
- plasma etching the substrate through the streets to singulate the integrated circuits.
Dependencies are inferred from the claim text.