Method of fabricating semiconductor device including a substrate attached to a carrier
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Youn Kim, Ji-Hwang Kim, Hae-Jung Yu, Cha-Jea Jo
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Abstract
A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.
Claims15
A method of fabricating a semiconductor device comprising:
- attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
- forming gaps between adjacent ones of the plurality of first semiconductor chips;
- filling the gaps with one or more chemicals to remove portions of the carrier fixing layer exposed in respective ones of the gaps;
- and
- electrically connecting a plurality of second semiconductor chips to respective ones of the plurality of first semiconductor chips,
- wherein the electrically connecting is performed between the attaching of the semiconductor substrate to the carrier and the forming of the gaps.
A method of fabricating a semiconductor device comprising:
- attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
- forming gaps by removing portions of the semiconductor substrate to expose the carrier fixing layer between adjacent ones of the plurality of first semiconductor chips;
- and
- irradiating light to each of the gaps to remove portions of the carrier fixing layer corresponding to respective ones of the gaps,
- wherein
- each of the plurality of first semiconductor chips comprises a first surface opposing a second surface, and
- the carrier is attached to the first surface of each of the plurality of first semiconductor chips by attaching the carrier fixing layer to the first surface of each of the plurality of first semiconductor chips.
A method of fabricating a semiconductor device comprising:
- attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of semiconductor chips;
- forming gaps between adjacent ones of the plurality of first semiconductor chips;
- forming first separation spaces in the carrier fixing layer corresponding to the gaps by irradiating laser light to the carrier fixing layer through the gaps;
- and
- forming second separation spaces in portions of the carrier fixing layer corresponding to the gaps, the forming the second separation spaces including removing portions of the carrier fixing layer interposed between the carrier and the plurality of first semiconductor chips by filling the gaps with one or more chemicals,
- wherein each of the first separation spaces is smaller than each of the second separation spaces.
A method of fabricating a semiconductor device, the method comprising:
- attaching a semiconductor substrate to a carrier using a carrier fixing layer, the semiconductor substrate including a plurality of first semiconductor chips;
- forming gaps between adjacent ones of the plurality of first semiconductor chips;
- forming first separation spaces in the carrier fixing layer corresponding to the gaps by irradiating laser light to the carrier fixing layer through the gaps;
- and
- forming second separation spaces in portions of the carrier fixing layer corresponding to the gaps, the forming the second separation spaces including removing the portions of the carrier fixing layer interposed between the carrier and the plurality of first semiconductor chips,
- wherein each of the first separation spaces is smaller than each of the second separation spaces.
Dependencies are inferred from the claim text.