Integrated circuit packaging system with lead frame and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsEmmanuel Espiritu, Henry Descalzo Bathan, Zigmund Ramirez Camacho
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming signal contacts; forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts; depositing a terminal pad on the power bar terminal; depositing a contact pad on one of the signal contacts; coupling an integrated circuit die to the power bar terminal and the signal contacts; and forming a package body on the integrated circuit die.
Claims10
A method of manufacture of an integrated circuit packaging system comprising:
- forming signal contacts;
- forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts;
- depositing a terminal pad and another of the terminal pad on and along the power bar and directly on the power bar terminal, the terminal pad and another of the terminal pad formed in a staggered position relative to the signal contacts;
- depositing a contact pad on one of the signal contacts;
- coupling an integrated circuit die to the power bar terminal and the signal contacts;
- and
- forming a package body on the integrated circuit die, the power bar, and the signal contacts including exposing the power bar terminal and the signal contact from the package body includes exposing a power bar body to be exposed from and coplanar with a bottom surface of the package body.
A method of manufacture of an integrated circuit packaging system comprising:
- forming signal contacts;
- forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts;
- forming a die paddle;
- depositing a terminal pad and another of the terminal pad on and along the power bar and directly on the power bar terminal, the terminal pad and another of the terminal pad formed in a staggered position relative to the signal contacts;
- depositing a contact pad and a bond pad on one of the signal contacts;
- depositing a die attach pad and a die paddle pad on the die paddle;
- connecting bond wires between the integrated circuit die and the bond pad and the bar bond pad;
- and
- forming a package body on the integrated circuit die, the power bar, and the signal contacts including exposing the power bar terminal and the signal contact from the package body includes exposing a power bar body to be exposed from and coplanar with a bottom surface of the package body.
Dependencies are inferred from the claim text.