Front facing piggyback wafer assembly
AssigneeInvensas Corporation
InventorsIlyas Mohammed, Masud Beroz, Liang Wang
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Abstract
Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.
Claims22
A method comprising:
- attaching a plurality of piggyback substrates to a carrier wafer, wherein said plurality of piggyback substrates are dissimilar in composition to said carrier wafer;
- forming and processing an active layer on said plurality of piggyback substrates, while attached to said carrier wafer, to produce a plurality of integrated circuit devices included in said active layer ;
- and
- singulating said plurality of integrated circuit devices to form individual integrated circuit devices.
A method comprising:
- attaching a plurality of piggyback substrates to a carrier wafer, wherein said plurality of piggyback substrates are dissimilar in composition to said carrier wafer;
- forming and processing an active layer on said plurality of piggyback substrates, while attached to said carrier wafer, to produce a plurality of integrated circuit devices included in said active layer;
- processing said carrier wafer to produce a plurality of integrated circuit structures;
- and
- singulating said plurality of integrated circuit devices to form individual integrated circuit devices.
A method comprising:
- attaching a plurality of piggyback substrates to a carrier wafer, wherein said plurality of piggyback substrates are dissimilar in composition to said carrier wafer;
- forming and processing an active layer on said plurality of piggyback substrates, while attached to said carrier wafer, to produce a plurality of light emitting diodes included in said active layer;
- forming conductive structures through said carrier wafer to electrically couple to contacts of said plurality of light emitting diodes;
- and
- singulating said plurality of light emitting diodes to form individual light emitting diode devices.
Dependencies are inferred from the claim text.