Manufacturing flexible organic electronic devices

A method of making a flexible organic light emitting device, comprising:

• forming a first portion comprising a first flexible substrate, the first portion being formed under a first set of conditions to provide a barrier system;
• separately forming a second portion comprising at least one organic electronic device region deposited upon a second flexible substrate, the second portion being formed under a second set of conditions, different from the first set of conditions;
• placing the first portion over the second portion to cover the organic electronic device region;
• forming a third portion comprising a third flexible substrate, the third portion being formed under a third set of conditions, which are different from the second set of conditions, to provide a barrier system;
• placing the third portion under the second portion, opposite a side of the second portion to which the first portion is positioned, wherein there is no exposure of the second portion to ambient atmosphere between the time of formation thereof and the time the third portion is placed thereunder;
• placing a flexible structure to enhance optical outcoupling between the organic electronic device region and the third portion, the flexible structure comprising a microlens array,
• wherein the organic electronic device region is not placed in physical contact with another solid material before placing the first portion over the second portion.

A method of making a flexible organic light emitting diode device, comprising:

• forming a first portion to provide a first flexible barrier system;
• separately forming a second portion comprising at least one organic light emitting diode device region deposited upon a second flexible substrate, wherein the second flexible substrate has a refractive index no more than 0.1 less than a refractive index of a light emitting layer of the organic light emitting diode device region;
• separately forming a third portion to provide a second flexible barrier system;
• placing the first portion over the second portion to cover the organic light emitting diode device region;
• placing a flexible structure to enhance optical outcoupling under the second portion, opposite a side of the second portion to which the first portion is attached;
• placing the third portion under the flexible structure to enhance optical out-coupling, and
• providing at least one sealing engagement to sealingly encapsulate the second portion and the flexible structure to enhance optical out-coupling between the first portion and the third portion.