Photoresist composition and method of forming a metal pattern using the same

A method of forming a metal pattern, the method comprising:

• forming a metal layer on a base substrate;
• coating a photoresist composition on the metal layer to form a coating layer, the photoresist composition comprising about 5% to about 50% by weight of a binder resin, about 0.5% to about 30% by weight of a photo-sensitizer, about 0.1% to about 2% by weight of a mercaptopropionic acid compound and a remainder of a solvent;
• exposing the coating layer to a light;
• partially removing the coating layer to form a photoresist pattern;
• and
• patterning the metal layer by using the photoresist pattern as a mask.