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US 8,911,848 B2Granted
CCL and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorYoung Kyung Kim
Life of this patent
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Abstract
There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.
Claims5
A copper clad laminate (CCL) comprising:
- a metal plate;
- an insulating layer on the metal plate and having a planar area greater than that of the metal plate;
- and
- a copper layer on the insulating layer,
- wherein edges of the insulating layer and edges of the copper layer extend outwardly beyond edges of the metal plate so that an insulation distance which electrically insulates the edges of the metal plate from the edges of the copper layer is formed.
2 more elements
Dependencies are inferred from the claim text.