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US 8,911,608 B1Granted
Flexible circuit formation
AssigneeSRI International
InventorsSunity Sharma, Jaspreet Singh Dhau
Life of this patent
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Abstract
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Claims17
A method for producing one or more conductive lines on a substrate, the method comprising:
- depositing a palladium precursor solution onto the substrate, wherein the palladium precursor solution includes at least palladium propionate, amyl acetate and cyclopentylamine;
- exposing the palladium precursor solution to conditions that promote evaporation of the amyl acetate to leave a palladium precursor on the substrate;
- decomposing the palladium precursor to leave a pattern of active palladium having a valence that is approximately zero, wherein the active palladium is substantially monatomically disposed on the substrate in the form of single isolated atoms;
- and
- depositing a metal atop the pattern of active palladium on the substrate to form one or more conductive lines.
2 more elements
A method of forming an electrically conductive circuit on a substrate, the method comprising:
- depositing a palladium precursor solution on the substrate, wherein the palladium precursor solution includes at least palladium propionate, amyl acetate and cyclopentylamine;
- exposing the palladium precursor solution to one or more conditions that promote evaporation of the amyl acetate to leave a palladium precursor on the substrate;
- decomposing the palladium precursor to leave a pattern of active palladium that is substantially monatomically disposed on the substrate, wherein the active palladium has approximately a zero valence;
- and
- depositing a metal onto the active palladium on the substrate to form the electrically conductive circuit.
2 more elements
Dependencies are inferred from the claim text.