Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement

Abstract

The present patent application relates to a wafer support arrangement, comprising a wafer (1), a support layer system (5, 6) and a separating layer (4), which is arranged between the support layer system (5, 6) and the wafer (1), wherein the support layer system (5, 6) (i) comprises a support layer (6) and (ii) a layer (5) from a through hardened, partially hardened or hardenable elastomer material on the separating layer side or consists of these two layers and wherein the separating layer (4) (iii) is a plasma polymer layer and (iv) the adhesive bond between the support layer system (5, 6) and the separating layer (4), after the elastomer material has through hardened, is greater than the adhesive bond between the wafer (1) and the separating layer (4).

Dependencies are inferred from the claim text.