Back to results
US 8,911,518 B1Granted
Method and system for dicing substrates containing gallium and nitrogen material with conductive core via structures
AssigneeSoraa, Inc.
InventorsArpan Chakraborty, Michael R. Krames, Tal Margalith, Rafael Aldaz
Life of this patent
Estimating the term…
Abstract
The present disclosure relates generally to semiconductor techniques. More specifically, embodiments of the present disclosure provide methods for efficiently dicing substrates containing gallium and nitrogen material. Additionally, the present disclosure provides techniques resulting in an optical device comprising a substrate having a dislocation bundle center being used as a conductive region for a contact.
Claims13
A method for manufacturing optical devices comprising:
- providing a substrate, the substrate comprising gallium and nitrogen material, the substrate having a plurality of dislocation bundle centers, the plurality of dislocation bundle centers being aligned according to a predetermined pattern;
- locating at least a first dislocation bundle center and a second dislocation bundle center;
- isolating at least one dislocation bundle center using an isolation region between the at least one dislocation bundle center and an active region and a p-type region;
- separating at least one optical device comprising a portion of the substrate configured with the at least one dislocation bundle center;
- and
- using the at least one dislocation bundle center as an n-type contact region.
3 more elements
A method for manufacturing an optical device comprising:
- providing a substrate, the substrate comprising gallium and nitrogen material, the substrate having a plurality of dislocation bundle centers, the plurality of dislocation bundle centers being aligned according to a predetermined pattern;
- locating at least a first dislocation bundle center and a second dislocation bundle center;
- defining a first line, the first line connecting at least the first dislocation bundle center and the second dislocation bundle center, the first line being substantially straight;
- locating a third dislocation bundle center;
- defining a second line, the second line connecting at least the first dislocation bundle center and the third dislocation bundle center, the second line being substantially straight;
- cutting the substrate along the first line;
- cutting the substrate along the second line;
- and
- forming the optical device comprising at least one of the dislocation bundle centers configured as a contact region, the optical device having a first edge formed by cutting the substrate along the first line.
6 more elements
Dependencies are inferred from the claim text.