Method for trimming the working layers of a double-side grinding apparatus

A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpieces, the method comprising:

• providing the grinding apparatus including the upper and lower working disks;
• providing at least one carrier including an outer toothing;
• rotating the upper and lower working disks;
• moving the at least one carrier between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks,
• adding loose abrasive to a working gap formed between the working layers,
• moving the at least one carrier, without workpieces inserted therein, in the working gap so as to effect material removal from the working layers;
• wherein each of the working layers is elastic and is detachable from a respective working disk by a peeling movement and includes at least the three following layers:
• a useful layer, facing away from the working disk, including bonded abrasive and having a useful thickness of more than one abrasive grain layer;
• a central continuous support layer supporting the useful layer and connecting elements of the useful layer to form a continuous unit;
• and
• a mounting layer facing the working disk and forming a force-locking or positively locking composite assembly with the working disk over a period of a usable life of the useful layer.