Connection member, socket module, socket and method for manufacturing connection member

A socket module that is arranged and electrically connected between an electronic component and a substrate, comprising:

• a body unit that has an upper surface, a lower surface and a side surface;
• and
• at least three connection members that are provided in the body unit, project from each of the upper surface and the lower surface, and are movable in a projection direction and a retraction direction;
• each of the connection members including:
• a first end portion that is connected to the electronic component;
• a second end portion that is connected to the substrate;
• a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component;
• and
• a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate;
• wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform, and
• the connection member includes a twist at a middle point thereof so that a left half of the connection member overlaps with a right half of the connection member.

A socket that is arranged and electrically connected between an electronic component and a substrate, the socket comprising:

• a plurality of socket modules;
• each of the socket modules includes:
• a body unit that has an upper surface, a lower surface and a side surface;
• and
• at least three connection members that are provided in the body unit, project from each of the upper surface and the lower surface, and are movable in a projection direction and a retraction direction;
• each of the connection members including:
• a first end portion that is connected to the electronic component;
• a second end portion that is connected to the substrate;
• a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component;
• and
• a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate;
• wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform.