Apparatus for manufacturing a semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsTae Yun Lee, Seong Wook Cheong, Byeong Kap Choi, Sang Jin Choi
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Abstract
An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.
Claims14
An apparatus for manufacturing a semiconductor package, comprising:
- a first mold having a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold section are brought together;
- a rotator coupled to the first mold and configured to rotate on a rotating axis;
- and
- a driver between the first mold and the rotating axis, the driver configured to supply a molding resin into the cavity based on a centrifugal force generated when the rotator rotates on the rotating axis;
- wherein the rotator includes:
- a first end coupled to the first mold;
- and
- a second end opposing the first end and coupled to a balance mass, the balance mass having a weight that at least partially offsets a mass of the first mold.
An apparatus for manufacturing a semiconductor package, comprising:
- a rotator configured to rotate on a rotating axis;
- a first mold configured to rotate along with the rotator;
- and
- a transfer mass coupled to the first mold and configured to apply a pressure to supply a molding resin into the first mold, the transfer mass moving from a first position to a second position based on a centrifugal force generated by rotation of the rotator;
- wherein the rotator includes:
- a first end coupled to the first mold;
- and
- a second end opposing the first end and coupled to a balance mass, the balance mass having a weight that at least partially offsets a mass of the first mold.
Dependencies are inferred from the claim text.