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US 8,910,356 B2Granted
Method of attaching an electronic device to an MLCC having a curved surface
AssigneeKemet Electronics Corporation
InventorsMichael S. Randall, Chris Wayne, John McConnell
Life of this patent
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Abstract
A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.
Claims6
A method of forming an electrical connection comprising:
- providing a capacitor wherein said capacitor has a mounting surface with a curvature deviation exceeding 0.008 inches per inch;
- providing an electronic component;
- forming a conductive column comprising conductive balls between said capacitor and said electronic component wherein said conductive column has a height which is at least as large as a sum of said curvature deviation, a stand-off distance between said capacitor and said electronic component and a compression distance;
- and
- bonding said capacitor to said electronic component through said conductive column.
2 more elements
Dependencies are inferred from the claim text.