Base material with single-crystal silicon carbide film, method of producing single-crystal silicon carbide film, and method of producing base material with single-crystal silicon carbide film
AssigneeSeiko Epson Corporation
InventorHiroyuki Shimada
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Abstract
In a base material with a single-crystal silicon carbide film according to an embodiment of the invention, a plurality of recessed portions is formed on the surface of a silicon substrate, an insulating film including silicon oxide is formed across the surface of the silicon substrate including the inner surfaces of the recessed portions, the top surfaces of side wall portions of recessed portions of the insulating film form flat surfaces, a single-crystal silicon carbide film is joined on the flat surfaces, and the recessed portions below the single-crystal silicon carbide film form holes.
Claims14
A base material with a single crystal silicon carbide film, comprising:
- an insulating film including silicon oxide disposed on a silicon substrate or a single crystal silicon film on a substrate;
- the single crystal silicon carbide film disposed on the insulating film,
- the insulating film being disposed on a plurality of recessed portions of the silicon substrate or the single crystal silicon,
- the single crystal silicon carbide film being disposed on the top end of the insulating film and the single crystal silicon carbide film being supported only by the insulating film, and
- a plurality of holes being surrounded by the insulating film and the single-crystal silicon carbide film, wherein the plurality of recessed portions are formed from the surface of the silicon substrate or the surface of the single crystal silicon film by selectively removing the silicon substrate or the single crystal silicon film.
A method of producing a single crystal silicon carbide film, comprising:
- forming a first silicon carbide layer on a surface of a silicon substrate or a surface of a single crystal silicon film;
- forming a second silicon carbide layer by selectively removing the first silicon carbide layer;
- forming a plurality of recessed portions from the surface of the silicon substrate or the surface of the single crystal silicon film by selectively removing the silicon substrate or the single crystal silicon film using the second silicon carbide layer as a mask;
- forming an insulating film including silicon oxide on the silicon substrate or the single crystal silicon film by performing thermal oxidation of the plurality of recessed portions;
- and
- forming a single crystal silicon carbide film on the insulating film,
- a plurality of holes surrounded by the insulating film and the single crystal silicon carbide film being formed by the forming the single crystal silicon carbide film, and
- the single crystal silicon carbide film is supported only by the insulating film.
Dependencies are inferred from the claim text.