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US 8,901,535 B2Granted
Semiconductor nanoparticle assembly
AssigneesKonica Minolta Medical & Graphic, Inc., Tohoku University
InventorsMasaru Takahashi, Kensaku Takanashi, Hideki Hoshino, Kohsuke Gonda, Motohiro Takeda, Noriaki Ohuchi
Life of this patent
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Abstract
A semiconductor nanoparticle assembly including semiconductor nanoparticles having a core/shell structure, and wherein the semiconductor nanoparticles are bonded by means of amide bonds.
Claims6
A semiconductor nanoparticle assembly containing semiconductor nanoparticles each having a core/shell structure, wherein:
- the semiconductor nanoparticles are bonded to each other by amide bonding, and
- an average particle size of the assembly is within a range of 50 to 500 nm.
Dependencies are inferred from the claim text.