Method for forming circular patterns on a surface
AssigneeD2S, Inc.
InventorsAkira Fujimura, Michael Tucker
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AssigneeD2S, Inc.
InventorsAkira Fujimura, Michael Tucker
Estimating the term…
A method for forming patterns on a surface using charged particle beam lithography is disclosed, in which a stencil is provided comprising first and second apertures, where circular or nearly-circular patterns in a first plurality of sizes are formed on the surface using the first aperture by varying shot dosage, and where circular or nearly-circular patterns in a second plurality of sizes are formed on the surface using the second aperture by varying shot dosage. A similar method for fracturing or mask data preparation is also disclosed. A stencil for charged particle beam lithography is also disclosed, where the stencil comprises first aperture and second apertures capable of forming, in one shot, patterns in a first and a second range of sizes on a surface by varying the shot dosage, where the first range of sizes is discontinuous with the second range of sizes.
A method for forming patterns on a surface using charged particle beam lithography, the method comprising:
A method for fracturing or mask data preparation for charged particle beam lithography, the method comprising:
A stencil for charged particle beam lithography comprising:
A system for forming patterns on a surface using charged particle beam lithography comprising:
Dependencies are inferred from the claim text.