Joint method, joint apparatus and joint system

A joint system comprising a joint apparatus comprising a first holding unit that suction-holds a processing target substrate and a second holding unit that is arranged to face the first holding unit and suction-holds a supporting substrate and joining the processing target substrate and the supporting substrate together by pressing the second holding unit toward the first holding unit while heating the substrates by heating mechanisms of the holding units, said system comprising:

• a processing station and a transfer-in/out station that transfers the processing target substrate, the supporting substrate, or a superposed substrate in which the processing target substrate and the supporting substrate are joined together into/out of said processing station, wherein said processing station comprises:
• a coating apparatus that applies an adhesive to the processing target substrate or the supporting substrate;
• a thermal processing apparatus that heats the processing target substrate or the supporting substrate to which the adhesive has been applied to a predetermined temperature;
• and
• a transfer region for transferring the processing target substrate, the supporting substrate, or the superposed substrate, to the coating apparatus, the thermal processing apparatus, and the joint apparatus, and
• wherein the joint apparatus has a preheating unit that preheats at least the processing target substrate before the processing target substrate is suction-held on the first holding unit.