Cooling in high-density storage systems
AssigneeHewlett-Packard Development Company, L.P.
InventorsShailesh N. Joshi, Richard Bargerhuff, Jeff Giardina
Life of this patent
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Abstract
In one embodiment an enclosure for a high-density storage system, comprises a backplane to which a plurality of data storage devices may be coupled, a front panel opposite the backplane and defining a first airflow channel adjacent a front side of the data storage devices, a back panel opposite the front panel and comprising a second airflow channel adjacent the backplane, a floor panel and a top panel, a first side panel comprising an array of air flow inlets, a second side panel comprising at least one air flow outlet, and a fan assembly to expel air from the at least one air outlet.
Claims17
An enclosure for a high-density storage system, comprising:
- a backplane to which a plurality of data storage devices may be coupled;
- a front panel opposite and substantially parallel to the backplane and defining a first airflow channel substantially parallel to a front side of the data storage devices;
- a back panel opposite and substantially parallel to the front panel and comprising a second airflow channel substantially parallel to the backplane;
- a floor panel and a top panel;
- a first side panel comprising an array of air flow inlets;
- a second side panel comprising at least one air flow outlet;
- at least one airflow blocking member to impede airflow;
- and
- a fan assembly to expel air from the at least one air outlet.
The enclosure of claim wherein the enclosure is adapted to hold a stack of data storage devices, and wherein the enclosure provide an airflow space between each the data storage device devices.
A high-density storage system, comprising:
- a plurality of data storage devices;
- a backplane to which the plurality of data storage devices may be coupled;
- an enclosure comprising:
- a front panel opposite the backplane and defining a first airflow channel adjacent a front side of the data storage devices;
- a back panel opposite the front panel and comprising a second airflow channel adjacent the backplane;
- a floor panel and a top panel;
- a first side panel comprising an array of air flow inlets;
- a second side panel comprising at least one air flow outlet;
- at least one airflow blocking member positioned in the first airflow channel to impede airflow through the first airflow channel;
- and
- a fan assembly to expel air from the at least one air outlet.
A method to cool a high-density storage system, comprising:
- activating a fan system assembly to create a low pressure region within a storage enclosure;
- drawing air throughout the storage enclosure from at least two different directions;
- impeding an airflow path through the airflow channel;
- and
- expelling the air from an air outlet in the storage enclosure.
Dependencies are inferred from the claim text.