Micro-link high-bandwidth chip-to-chip bus
AssigneeOracle International Corporation
InventorsRobert P. Masleid, Sreemala Pannala, Michael L. Cooper, Bidyut K. Sen
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Abstract
A chip package includes a micro-link between components disposed on a substrate. The micro-link may be an ultra-short multi-conductor transmission line with shared reference planes that results in a distribution of impedance values. Furthermore, the composite signal traces in the transmission line each can support communication of one symbol at a time by ensuring that multiple reflections reach a substantial fraction of a steady-state value within a symbol time. In this way, the micro-link may facilitate continued scaling of the communication bandwidth between the components with low latency to increase the performance of computer systems that include the chip package.
Claims20
A chip package, comprising:
- a substrate;
- first connectors, disposed on the substrate, configured to couple to a first component;
- second connectors, disposed on the substrate, configured to couple to a second component;
- and
- a micro-link, disposed on the substrate, having a first end coupled to the first connectors and a second end coupled to the second connectors,
- wherein the micro-link includes more signal lines than return paths;
- wherein a length of the micro-link is less than a pre-defined value;
- wherein the micro-link results in a distribution of impedance values, and
- wherein, when a symbol is communicated between the first component and the second component through at least one of the signal lines in the micro-link, multiple reflections reach a substantial fraction of a steady-state value within a symbol time.
A system, comprising:
- a processor;
- a memory configured to store a program module, wherein the program module is configurable to be executed by the processor;
- and
- a chip package, wherein the chip package includes:
- a substrate;
- a first component electrically coupled to first connectors, which are disposed on the substrate;
- a second component electrically coupled to second connectors, which are disposed on the substrate;
- and
- a micro-link, disposed on the substrate, having a first end coupled to the first connectors and a second end coupled to the second connectors,
- wherein the micro-link includes more signal lines than return paths;
- wherein a length of the micro-link is less than a pre-defined value;
- wherein the micro-link results in by a distribution of impedance values, and
- wherein, when a symbol is communicated between the first component and the second component through at least one of the signal lines in the micro-link, multiple reflections reach a substantial fraction of a steady-state value within a symbol time.
A method for communicating a symbol between a first component and a second component using a micro-link in a chip package, wherein the method comprises:
- driving the symbol from the first component onto a signal line in the micro-link, wherein the micro-link includes more signal lines than return paths, wherein a length of the micro-link is less than a pre-defined value, and wherein the micro-link results in a distribution of impedance values;
- and
- receiving the symbol at the second component through the signal line after multiple reflections reach a substantial fraction of a steady-state value within a symbol time.
Dependencies are inferred from the claim text.