US 8,897,027 B2Granted

Bonding pad structure

AssigneeWintek Corporation

InventorsHan-Chung Chen, Chun-Yi Wu, Shih-Cheng Wang, Chin-Mei Huang, Tsui-Chuan Wang, Pei-Fang Tsai

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Abstract

A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Claims11

Dependent claims

A bonding pad structure for connecting an electronic component mounted on a printed circuit board (PCB), said structure, comprising:

two bonding pad units, symmetrically disposed with respect to an axial line;
wherein, each bonding pad unit has at least two bonding pads, each of the at least two bonding pads is composed of at least one first bonding pad and at least one second bonding pad in a manner that the first bonding pad is arranged next to the axial line,
and the second bonding pad is arranged at a side of the corresponding first bonding pad that is away from the axial line, and further the first bonding pad and the corresponding second bonding pad are interconnected to each other by a first neck portion:
wherein the first bonding pad, the second bonding pad, and the first neck portion are used for soldering the electronic component so as a plurality of solder areas of different sizes are formed by interconnecting the two bonding pad units.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 13/117,614Filed 27 May 2011
Priority: TW 99117523 A1 Jun 2010
Published: US 2011/0292625 A11 Dec 2011
Granted: 25 Nov 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification18 codes

H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 1/0295
Programmable, customizable or modifiable circuits: adapted for choosing between different types or different locations of mounted components
H05K 3/3442
Leadless components: having edge contacts, e.g. leadless chip capacitors, chip carriers
H05K 2201/09381
Pads and lands: shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component