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US 8,897,024 B2Granted
Method for manufacturing a suspension board assembly sheet with circuits
AssigneeNitto Denko Corporation
InventorsTerukazu Ihara, Tetsuya Ohsawa
Life of this patent
Estimating the term…
Abstract
An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.
Claims2
A method for manufacturing a suspension board assembly sheet including a plurality of suspension boards with circuits and a support frame, comprising the steps of:
- preparing a metal substrate;
- forming an insulating layer having a first portion for said plurality of suspension boards and a second portion for said support frame on said metal substrate;
- producing the plurality of suspension boards and said support frame by forming first conductor traces for said plurality of suspension boards that constitute the circuits on the first portion of the insulating layer and forming a second conductor trace for said support frame on the second portion of the insulating layer, and providing a plurality of identification marks for identifying respective positions of said plurality of suspension boards corresponding to each of said plurality of suspension boards in the second conductor trace;
- and
- identifying the respective positions of the suspension boards using said plurality of identification marks and performing automatic optical inspection to the suspension boards.
2 more elements
Dependencies are inferred from the claim text.