Electronic device and heat dissipation module thereof

An electronic device, comprising:

• a circuit board comprising an electronic element;
• and
• a casing, in which the circuit board is disposed, comprising:
• a mainframe;
• and
• a heat dissipation module disposed on a side of the mainframe, being in thermal contact with the electronic element, and having an imaginary structural plane, the heat dissipation module comprising:
• a fin assembly disposed on the structural plane and comprising a plurality of fin elements extending along a first direction;
• a connecting part connected to the fin elements, wherein the fin elements are connected to each other via the connecting part;
• and
• a heat pipe, wherein at least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction;
• wherein the fin assembly and the connecting part are integrated and formed into one piece by die casting, and the first direction and the second direction form a first included angle greater than 0 degree together.

A heat dissipation module, for being in thermal contact with an electronic element and having an imaginary structural plane, comprising:

• a connecting part including a container;
• a plurality of fin elements extending outwardly from the structural plane, wherein each of the fin elements has an outer surface away from the structural plane, respectively;
• a heat-absorbing plate connected to at least one of the fin elements and including a contact surface coplanar with the structural plane, wherein the heat-absorbing plate is used for being in thermal contact with the electronic element at the contact surface;
• and
• a heat pipe disposed in the container and for being in thermal contact with the heat-absorbing plate and the connecting part.