Back to results
US 8,896,809 B2Granted
Lithographic apparatus and device manufacturing method
AssigneeASML Netherlands B.V.
InventorsJudocus Marie Dominicus Stoeldraijer, Erik Roelof Loopstra, Jan Bernard Plechelmus Van Schoot, Diederik Jan Maas
Life of this patent
Estimating the term…
Abstract
A lithographic apparatus and method is disclosed to reduce the exposure time that a substrate spends within a main lithographic apparatus by pre- (or post-) exposing one or more edge devices on the substrate. Because an edge device does not ultimately yield a useful device, it can be exposed with a lithographic apparatus that has a lower resolution than that used to expose one or more of the other, complete devices produced from the substrate. Therefore, the pre- (or post-) exposure of an edge device can be performed using a less complex, and less expensive, lithographic device.
Claims21
A lithographic apparatus, comprising:
- a first lithographic device arranged to project a first pattern onto a substrate to expose a target portion of a resist layer of the substrate that is contained wholly within a periphery of the substrate, but not to expose a target portion that intersects the periphery of the substrate, the first lithographic device being configured to project the first pattern with a first resolution and including a first substrate table configured to hold the substrate during exposure of the substrate with the first pattern;
- and
- a second lithographic device arranged to project a second pattern onto the substrate to expose a target portion of the substrate that is not exposed by the first lithographic device, the second lithographic device being configured to project the second pattern with a second resolution, the second resolution being lower than the first resolution, and including a second substrate table configured to hold the substrate during exposure of the substrate with the second pattern, wherein the first lithographic device exposes a same resist layer of the substrate as the second lithographic device, wherein the second substrate table is configured to rotate about an axis that is substantially normal to the plane of the substrate to expose multiple target positions of the substrate that are not exposed by the first lithographic device, and wherein the second substrate table is movable relative to the second lithographic device so that only an edge of the substrate held by the second substrate table is positionable under an exposure part of the second lithographic device.
A lithographic apparatus, comprising:
- a first lithographic device arranged to project a first pattern onto a substrate to expose a target portion of a resist layer of the substrate that is contained wholly within a periphery of the substrate, but not to expose a target portion that intersects the periphery of the substrate, the first lithographic device being configured to project the first pattern with a first resolution and including a first substrate table configured to hold the substrate during exposure of the substrate with the first pattern;
- and
- a second lithographic device arranged to project a second pattern onto the substrate to expose a target portion of the substrate that is not exposed by the first lithographic device, the second lithographic device being configured to project the second pattern with a second resolution, the second resolution being lower than the first resolution, and including a second substrate table configured to hold the substrate during exposure of the substrate with the second pattern, wherein the first lithographic device exposes a same resist layer of the substrate as the second lithographic device, wherein the second lithographic device comprises a programmable patterning device configured to impart the second pattern onto a radiation beam, and wherein the second substrate table is movable relative to the second lithographic device so that only an edge of the substrate held by the second substrate table is positionable under an exposure part of the second lithographic device.
A dual stage lithographic apparatus, comprising:
- an exposure station comprising a first lithographic device arranged to expose a target portion of a resist layer of a substrate that is contained wholly within a periphery of the substrate, but not to expose a target portion that intersects the periphery of the substrate, the first lithographic device being configured to expose said target portion with a first resolution and including a first substrate table configured to hold the substrate during exposure of said target portion of the substrate;
- and
- a measurement station comprising a second lithographic device arranged to expose a target portion of the substrate that is not exposed by the first lithographic device, the second lithographic device being configured to expose said target portion not exposed by the first lithographic device with a second resolution, the second resolution being lower than the first resolution, and including a second substrate table configured to hold the substrate during exposure of said target portion not exposed by the first lithographic device, wherein the first lithographic device exposes a same resist layer of the substrate as the second lithographic device and the second lithographic device comprises a programmable mirror array, and comprising a measurement device configured to perform measurements on a substrate, wherein the measurement station includes a third substrate table configured to hold the substrate during measurements of the substrate, and wherein the second substrate table is movable relative to the second lithographic device so that only an edge of the substrate held by the second substrate table is positionable under an exposure part of the second lithographic device.
Dependencies are inferred from the claim text.