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US 8,896,397 B2Granted
Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device
AssigneeIntellectual Ventures Fund 77 LLC
InventorKenichi Anasako
Life of this patent
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Abstract
A surface acoustic wave device comprises a piezoelectric substrate (1), at least one inter-digital transducers (IDT) (2) provided on the piezoelectric substrate, at least one elongated electrode pad (4) electrically connected to the IDT, and at least one stud bump (5) disposed on the electrode pad such that an LC component of the surface acoustic wave device has a predetermined value.
Claims20
A device, comprising:
- an electrode pad comprising a first wiring pattern and a second wiring pattern connected together at a common end and electrically short-circuited by a first stud bump, wherein an entirety of a second stud bump is located on at least one of the first wiring pattern or the second wiring pattern, and the electrode pad is electrically connected to an inter-digital transducer attached to a piezoelectric substrate.
A method, comprising:
- converting a first electrical signal to a surface acoustic wave using an electrode pad electrically connected to an inter-digital transducer attached to a piezoelectric substrate, wherein the electrode pad comprises a first wiring pattern connected to a second wiring pattern at a common end and electrically short-circuited to the second wiring pattern via a first stud bump, and an entirety of a second stud bump is disposed on at least one of the first wiring pattern or the second wiring pattern;
- and
- converting the surface acoustic wave to a second electrical signal by the inter-digital transducer.
An apparatus, comprising:
- means for converting an electrical signal to a surface acoustic wave;
- means for conducting the electrical signal to the means for converting, wherein the means for conducting comprises a first wiring pattern connected to a second wiring pattern at a common end;
- first bump means for electrically short-circuiting the first wiring pattern to the second wiring pattern;
- and
- second bump means for setting a value of a product of an inductance and a capacitance of the apparatus, wherein the second bump means is positioned entirely on one of the first wiring pattern or the second wiring pattern.
2 more elements
Dependencies are inferred from the claim text.