Chip identification for organic laminate packaging and methods of manufacture
AssigneeInternational Business Machines Corporation
InventorsAlbert J. Banach, Timothy H. Daubenspeck, Wolfgang Sauter
Life of this patent
Estimating the term…
Abstract
A chip identification for organic laminate packaging and methods of manufacture is provided. The method includes forming a material on a wafer which comprises a plurality of chips. The method further includes modifying the material to provide a unique identification for each of the plurality of chips on the wafer. The organic laminate structure includes a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip.
Claims13
An organic laminate structure comprising a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip,
- wherein the material is metal, and
- the metal includes an adhesion layer and a cap layer.
An organic laminate structure comprising a chip with a device and a material placed on the chip and which is modified to have a unique identification mark for the chip,
- wherein the material is a polyimide material on a backside of the chip or a ball limiting metallurgy (BLM) material on the backside of the chip,
- when the material is the BLM material, the modified material includes arranging the BLM material so that patterns are formed which are unique to the chips on the wafer;
- and
- when the material is the polyimide material, the modifying includes a unique pattern formed for each of a plurality of chips on the wafer.
An organic laminate structure comprising a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip, wherein the material is polyimide formed on a top side of the wafer and the modified material includes one of a patterned polyimide and scribed patterned polyimide.
Dependencies are inferred from the claim text.