Encapsulation film, package structure utilizing the same, and method for forming the package structure

A method for forming a package structure, comprising:

• providing an optotronic device;
• wrapping the optotronic device by an organic layer composed of a polymer having hydrophilic groups;
• and
• depositing an inorganic oxide layer on the organic layer by an atomic layer deposition process, wherein the inorganic oxide layer directly contacts the organic layer,
• wherein the inorganic oxide layer and the organic layer have covalent bondings therebetween,
• wherein the hydrophilic groups are hydroxyl groups or carboxylic acid groups,
• wherein the inorganic oxide layer is a multi-layered structure of alternately arranged aluminum oxide/hafnium oxide.