Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
AssigneeInfineon Technologies AG
InventorsKhalil Hosseini, Joachim Mahler, Georg Meyer-Berg
Life of this patent
Estimating the term…
Abstract
An integrated circuit is provided, the integrated circuit including: a chip having a first chip side and a second chip side opposite to the first chip side, the chip having at least one contact area on the second chip side; encapsulation material at least partially covering the chip; and at least one contact via comprising electrical conductive material contacting the at least one contact area and extending through the encapsulation material and through the chip between the first chip side and the second chip side.
Claims28
An integrated circuit comprising:
- a chip having a first chip side and a second chip side opposite to the first chip side, the chip comprising at least one contact area on the second chip side;
- encapsulation material at least partially covering the chip;
- and
- at least one contact via comprising electrical conductive material contacting the at least one contact area and extending through the encapsulation material and through the chip between the first chip side and the second chip side;
- wherein the encapsulation material comprises a first encapsulation portion disposed over the first chip side and a second encapsulation portion disposed over the second chip side;
- and
- wherein the at least one contact via is a single continuous electrically conductive structure extending through the chip, the first encapsulation portion and the second encapsulation portion.
A semiconductor die arrangement comprising:
- a semiconductor die;
- at least one contact via comprising electrical conductive material extending through the semiconductor die between a first side of the die and a second side of the die;
- and
- encapsulation material formed over the first side of the die and the second side of the die;
- wherein the at least one contact via electrically contacts a contact area on the second side of the die;
- wherein the at least one contact via is coupled to a contacting pad of an external circuit board;
- and
- wherein the at least one contact via is a single continuous electrically conductive structure extending through the die and the encapsulation material.
A method for manufacturing an integrated circuit, the method comprising:
- at least partially covering a chip with encapsulation material, the chip having a first chip side and a second chip side opposite to the first chip side, the chip comprising at least one contact area on the second chip side;
- forming at least one contact via extending through the encapsulation material and through the chip between the first chip side and the second chip side, the at least one contact via contacting the at least one contact area;
- forming a channel through the chip, the channel extending between the first chip side and the second chip side;
- and
- at least partially filling the channel with a single continuous electrically conductive structure, the single continuous electrically conductive structure contacting the at least one contact area and extending between the first chip side and the second chip side.
An integrated circuit comprising:
- a chip having a first chip side and a second chip side opposite to the first chip side, the chip comprising a depletion zone between the first chip side and the second chip side, and at least one contact area formed on the second chip side;
- encapsulation material at least partially covering the chip;
- and
- at least one contact via comprising a single continuous electrically conductive structure contacting at least one contact area and extending through the depletion zone;
- wherein the at least one contact via extends through the encapsulation material and through the chip between the first chip side and the second chip side.
Dependencies are inferred from the claim text.