Via network structures and method therefor
AssigneeNXP B.V.
InventorsYuan Li, Som Nath, Maarten Jeroen Van Dort
Life of this patent
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Abstract
A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
Claims15
An integrated circuit device providing a surface over a structural aspect of the integrated circuit device, the device comprising:
- at least one bond pad contact at the surface;
- at least one via network layer below each bond pad contact and connecting the bond pad contact with a metal layer, each via network layer including a plurality of via strips configured and arranged extending about parallel to the surface and in different directions to facilitate structural support of the bond pad contact;
- an insulating material between the via strips in each layer;
- and
- wherein a first one of the via network layers nearest the bond pad contact includes via strips including a first material that is different than a second material included in via strips in another one of the via network layers further from the bond pad contact than the first one of the via network layers, the first material being mechanically stronger than the second material.
An integrated circuit device comprising:
- a plurality of metal layers separated by an inter-metal dielectric layer;
- wherein the plurality of metal layers includes, at least one of the metal layers being mechanically stronger than another metal layer;
- a top inter-metal dielectric layer on an upper one of the metal layers;
- and
- a plurality of bond pad stacks, each bond pad stack including
- a bond pad contact extending laterally along a surface of the top inter-metal dielectric layer, and
- in each of the inter-metal dielectric layers below the bond pad contact, a network of interconnected via strips configured and arranged extending about parallel to the bond pad contact and in different directions to facilitate structural support of the bond pad contact, the via strips for each bond pad contact being separated from the via strips for other bond pad contacts by the inter-metal dielectric layer.
Dependencies are inferred from the claim text.