Semiconductor device bonded by an anisotropic conductive film
AssigneeCheil Industries Inc.
InventorsYoun Jo Ko, Jin Kyu Kim, Dong Seon Uh, Kil Yong Lee, Jang Hyun Cho
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Abstract
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.
Claims10
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.
Dependencies are inferred from the claim text.